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本文从分子水平的角度出发研究了阻燃剂对集成电路器件包封用热固性模塑复合物热降解的影响,同时研究了在塑封过程中与器件可靠性有关的问题。本文主要对以半导体级酚醛环氧树脂,半导体级有机硅环氧树脂和电子级酚醛环氧树脂为基础的三种模塑复合物的测试结果进行了比较。作者曾对包封用酚醛环氧树脂和有机硅环氧树脂的阻燃样品及其非阻燃样品进行过研究,本工作是过去研究工作的继续,本研究结果可适用于对半导体器件的老化进行研究。
In this paper, the effects of flame retardants on the thermal degradation of thermosetting molding compounds for encapsulation of integrated circuit devices were investigated at the molecular level, and the problems related to device reliability during plastic encapsulation were also studied. This paper compares the results of three molding compounds based on a semiconducting grade phenolic epoxy, a semiconductor grade silicone epoxy, and an electronic grade phenolic epoxy. The authors have studied the flame retardant samples of encapsulated phenolic epoxy resin and silicone epoxy resin and their non-flame retardant samples. This work is the continuation of past research work. The results of this study can be applied to the aging of semiconductor devices research.