论文部分内容阅读
PS/Au/Cu双壳层核壳复合微球是在自制的电沉积装置中首先在空心聚苯乙烯微球模板上电沉积金形成PS/Au微球,然后再电沉积Cu。首先,PS/Au微球保持了较好的球形度,其中沉积层Au粗糙度低,且厚度达到5.6μm。由于Au和铜有相同的面心立方晶体结构,所以Cu沿着Au的晶体结构在PS/Au表面沉积。微球断面Au-Cu结合非常紧致,Cu的厚度为8.62μm,Au的厚度为4.04μm。PS/Au/Cu微球和Au-Cu双壳层的形貌、厚度,成分和粗糙度是通过3D体式显微镜,SEM、EDS和XRD表征,其结果显示PS/Au/Cu微球及双壳层Au-Cu均匀细致,粗糙度低。
The PS / Au / Cu double-shell core-shell composite microspheres were fabricated by electrodepositing PS / Au microspheres on hollow polystyrene microspheres in a homemade electrodeposition apparatus and then electrodepositing Cu. First of all, the PS / Au microspheres retained a good sphericity, in which Au deposit had a low roughness and reached a thickness of 5.6 μm. Since Au and copper have the same face-centered cubic crystal structure, Cu is deposited on the PS / Au surface along the crystal structure of Au. The Au-Cu bond of the microsphere cross-section is very tight, the thickness of Cu is 8.62μm and the thickness of Au is 4.04μm. The morphology, thickness, composition and roughness of the PS / Au / Cu microspheres and the Au-Cu bilayer were characterized by SEM, SEM, EDS and XRD. The results showed that PS / Au / Cu microspheres and double shell Layer Au-Cu uniform, low roughness.