微带板钎焊技术是一种新的装配工艺,钎焊后微带板具有良好的接地、热传导性能,能有效增加微带线的功率容量;钎透率直接反映接地效果,是钎焊技术的重要指标,电路基板的大面积接地钎焊的缺陷对微波电路的性能影响较大,钎焊的缺陷是随机分布的,导致微带电路传输特性恶化,进而影响组件的电讯指标;分析此问题具有很重要的现实意义。 Microstrip brazing technology is a new assembly process, after brazing microstrip plate with good grounding, thermal conductivity, can effectively increase the microstrip line power capacity; penetration rate directly reflects the grounding effect is brazing technology Of the important indicators, the large area of ​​the circuit board brazing defects on the performance of the microwave circuit greater impact on the brazing defects are randomly distributed, leading to deterioration of the transmission characteristics of the microstrip circuit, thus affecting the components of the telecommunications indicators; analysis of this problem Has very important practical significance.